YANG, Zhandi. Thermal Management Challenges and the Role of Thermal Interface Materials in Advanced Packaging. Academic Journal of Management Science and Engineering, [S. l.], v. 1, n. 3, p. 53–58, 2026. DOI: 10.62051/ajmse.v1n3.08. Disponível em: https://ajomse.com/index.php/ojs/article/view/36. Acesso em: 25 aug. 2026.